学习经历：

1996-2000, 大连海事大学，材料工艺研究所，博士

1993-1996, 大连铁道学院，材料科学与工程系，硕士；

1989-1993, 吉林工业大学，金属材料科学与工程系，学士；

工作经历：

2019-现今, 中国科学院深圳先进技术研究院，研究员、博导；

2006-2019, 中国科学院金属研究所，研究员、博导；

2017-2018, 日本大阪大学，客座教授；

2002-2006, 日本国立材料科学研究所（NIMS），特别研究员；

2000-2002, 日本冈山理科大学，博士后。

代表性论文

1. Z.Q. Liu, H. Hashimoto, E. Sukedai, M. Song, K. Mitsuishi, K. Furuya, In situ observation of the formation of Fe3O4 in Fe4N (001) due to electron irradiation, Phys. Rev. Lett., 2003, 90:255504.

2. Z.Q. Liu, H. Hashimoto, M. Song, K. Mitsuishi, K. Furuya, Phase transformation from Fe4N to Fe3O4 due to electron irradiation in the transmission electron microscope, Acta Mater., 2004, 52:1669.

3. Z.Q. Liu, K. Mitsuishi, K. Furuya, A dynamic Monte Carlo study of the in situ growth of a substance deposited using electron-beam-induced deposition, Nanotechnology, 2006, 17:3832.

4. X.W. Xie, Y. Li, Z.Q. Liu, M. Haruta, W.J. Shen, Low-temperature oxidation of CO catalyzed by Co3O4 nanorods, Nature, 2009, 458:746.

5. H.H. Liu, S. Schmidt, H.F. Poulsen, A. Godfrey, Z.Q. Liu, J. Sharon, X. Huang, Three-dimensional orientation mapping in the transmission electron microscopy, Science, 2011, 332(6031):833.

6. C.F. Li, Z.Q. Liu, Microstructure and growth mechanism of tin whisker on RESn3 compounds, Acta Mater., 2013, 61:589.

7. S. Gao, Z.Q. Liu, C.F. Li, Y.Z. Zhou, T. Jin, In situ TEM investigation on the precipitation behavior of m phase in Ni-base single crystal superalloys, Acta Mater., 2016, 110:268.

8.J. Yuan, X.T. Qian, Z.C. Meng, B. Yang, Z.Q. Liu, High thermally conducting polymer-based films with magnetic field-assisted vertically aligned hexagonal boron nitride for flexible electronic encapsulation, ACS Appl. Mater. Inter., 2019, 11(19):17915.

9.Y. Gao, J.T. Jiu, C.T. Chen, K. Suganuma, R. Sun, Z.Q. Liu, Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test, J. Mater. Sci. Technol., 2022, 115:251.

10.M.H. Zhang, L.Y. Gao, Y.X. Wang, W. Dong, N. Zhao, Z.Q. Liu, Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding, Appl. Surf. Sci., 2024, 650:159184.